Pan-STARRS System Requirements Document
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Revision History: 
 - v1.0, 30 July 03, G. Luppino

Detector System Requirements

1. CCDs/OTAs
 1.1 Format
   1.1.1 Pixel size (Xpix, Ypix in mm)
   1.1.2 OTA die size (Xdie, Ydie in mm)
   1.1.3 Number of cells per OTA (n x m)
   1.1.4 Number of pixels per OTA cell (N x M)
   1.1.5 Column street width between OTA cells (x_street)
   1.1.6 Row street height between OTA cells (y_street)
   1.1.7 Left side die sawcut to first active pixel gap (xl_gap)
   1.1.8 Right side die sawcut to first active pixel gap (xr_gap)
   1.1.9 Pixel alignment: maintain integer pixel metrology over
         a single OTA
   1.1.10 Overall Fill OTA fill factor
  
 1.2 OTA QE
   1.2.1 Silicon Thickness
   1.2.2 AR coating
   1.2.3 Minimum QE requirements
       1.2.3.1 400nm  0.20
       1.2.3.2 500nm  0.60
       1.2.3.3 600nm  0.70
       1.2.3.4 700nm  0.80
       1.2.3.5 800nm  0.70
       1.2.3.6 900nm  0.40
       1.2.3.7 1000nm 0.10
   1.2.4 Fringing
 
 1.3 OTA Noise and Readout Time
   1.3.1 Maximum pixel rate (MPR)
   1.3.2 Noise requirement at MPR
   1.3.3 Guidestar pixel rate (GSPR)
   1.3.4 Noise requirement at GSPR
   1.3.4 Science Exposure Readout Time

 1.4 OTA MTF
   1.4.1 Charge diffusion
   1.4.2 Optical MTF degradation
   1.4.3 Electronic MTF degradation

 1.5 OTA Dark Current

 1.6 OTA Full Well

 1.7 OTA Charge Transfer Efficiency

 1.8 On-chip amplifier crosstalk

 1.9 OTA Clocking Requirements
   1.9.1 OTA Cell addressing
   1.9.2 OT clocking
 
 1.10 OTA cosmetics

 1.11 Additional OTA features
   1.11.1 Electronic Shutter

 1.12 OTA Power dissipation 

2. OTA Package
 2.1 Dimensions
   2.1.1 Die_edge-to-Package_edge gap - sides
   2.1.2 Die_edge-to-Package_edge gap - top
   2.1.3 Footprint
 2.2 Package flatness
 2.3 Package Material
 2.4 Electrical Properties and interface
   2.4.1 Bondpad Requirements
       2.4.1.1 Number of Bondpads
       2.4.1.2 Flip Symmetry for Front/Back pack
   2.4.2 Passive filtering
   2.4.3 Output drive transistors 
 2.5 Package Thermal Properties
 
3. Mosaic Focalplane
 3.1 Mosaic format
   3.1.1 Number of OTAs per Mosaic focalplane
   3.1.2 Gaps between packages
   3.1.3 Overall Mosaic Fill Factor
 3.2 Alignment of OTAs in focalplane mosaic
 3.3 Flatness of OTAs in focalplane mosaic

4. Cryostat Cooling System
 4.1 Operating Temperature
 4.2 Vacuum Requirements